HOME > Our Products > Industrial Films > Opulent™ (Heat-resistant release film)
High-performance polyolefin film with potential applications
■Transparency／■UV ray permeability／■Heat resistance／■Releasability／■Cushioning property／■Gas permeability／■Lightweight／■Low-dielectric property／■Punching quality／■Water resistance／■Transferability／■Non silicone
Our Opulent™ is a TPX-based high-performance polyolefin film.
Its superior release performance, heat resistance and cushioning properties, has made it the standard go-to brand of release or separator films for circuit board applications, including flexible printed-circuit board (FPC) with their typically complex surface geometry, rigid-flex circuit board and rigid circuit board. TPX holds enormous potential as a release or peel-off film for today’s state-of-the-art component materials, such as carbon fibers and ceramic green sheets.
Engineered to withstand temperatures up to 200°C, our TPX film is widely used as a release or peel-off film for pressing processes employing various thermosetting resins such as epoxy or phenolic resin.
Its excellent release performance and transferability make it an ideal film for transfer printing, as well as manufacturing transfer sheets and transfer foil. TPX’s cushioning properties also make it the perfect choice for films, sheets or foil when you need to transfer print to unusual surface contours. You can also leverage its excellent transparency and gas permeability for gas-permeable film, sheets, and films.
- ■Transparency
- Permeable to UV rays.
- ■Lightweight
- Its low density (830 kg/㎥) makes lighter molder products possible.
- ■Heat resistance
- Withstands temperatures up to 200°C.
- ■Low-dielectric property
- Can be used for high-frequency component materials due to its low-dielectric properties (ε = 2.1, tanδ = 0.0008 [@12 GHz]).
- ■Releasability
- Releasable from various materials.
- ■Punching quality
- Makes the cutting process burr-free.
- ■Superior cushioning property
- Fits to any surface pattern.
- ■Water resistance
- Its extremely low water absorption rate ensures dimensional stability.
- ■Gas permeability
- Its unique molecular structure makes it permeable to gasses.
- ■Non silicon (non-silicone)
- Since it’s made from non-silicon (non-silicone) materials, there’s no risk of contamination or transfer from silicon materials.
- ■Transferability
- Its excellent transfer and release performance makes it ideal for transfer printing.
*Embossed film is also available.
- ■Release film for flexible print-circuit board, rigid-flex print-circuit board and rigid print-circuit board
- Opulent™ provides an excellent balance between heat resistance and releasability in addition to fitting the contours of just about any surface. No wonder it’s such a popular release film for flexible print-circuit board.
- ■Release film for prepreg and pressing (CFRP, GFRP, AFRP, etc.)
- Opulent™ is widely used as a release film for prepreg processing and makes an exceptional release film for curing prepreg made of glass cloth, carbon or aramid fiber as well as epoxy resin.
- ■Film for thermoset resin processing
- The superior heat resistance of our Opulent™ makes it the perfect choice of release film for molding thermoset resins such as epoxy and phenolic resins.
- ■Film for transfer printing
- The outstanding release performance of Opulent™ has brought transfer printing to new heights. After printing on the TPX film (Opulent™), the film is transferred to the substrate and heated so it adheres to the surface. The film’s superior cushioning and flexibility enable perfect transfer printing to uneven surfaces.
- ■Release film for semiconductor and LED packaging
- Opulent™ offers huge advantages as a release film for resin molding of semiconductors (BGA and WLP) and white LEDs due to its heat resistance and outstanding release performance.
- ■Release film for liquid crystal display (LCD) manufacturing
- The superior release performance, heat resistance and cushioning properties of our Opulent™ make it an ideal release film for LCD manufacturing.
■Transparency
Able to transmit UV rays.
■Heat Resistance
With a melting point of approximately 230℃, Opulent™ can be processed at a temperature of 200℃.
■Release Property
An excellent release film for a variety of materials.
Opulent™ indicates superior release performance when used with various materials, including epoxy resins, due to its low surface tension.
■Cushioning Property
Fits to any contour.
With a softening temperature of approximately 40℃, Opulent™ easily fits to any contour.
■Gas Permeability
Opulent™'s unique molecular structure makes it permeable to gasses.
Although Opulent™ is a nonporous film, it’s as gas permeable as micro-porous film.
■Lightweight
Opulent™'s low density (830 kg/m³）makes for lightweight molded products.
■Low-dielectric property
Ideal for high-frequency components due to its low-dielectric property (ε = 2.1, tanδ = 0.0008 [@12GHz])
| Grade | Single-layer film | |||||||
| X-44B | Ｘ-88B | X-88BMT4 | ||||||
| Thickness | 25μm | 50μm | 50μm（*1） | 50μm（*1） | ||||
| Item | Unit | Test method / Surface treatment |
Untreated surface (gloss) |
Untreated surface (gloss) |
Untreated surface (gloss) |
Both sides embossed (both sides matte) |
||
| Tensile modulus （MD） |
Mpa | ASTM D882 | 1650 | 1650 | 2100 | 2000 | ||
| Yield point strength （MD） |
Mpa | ASTM D882 | 26 | 25 | 30 | 29 | ||
| Tensile strength （MD） |
Mpa | ASTM D882 | 40 | 30 | 33 | 32 | ||
| Elongation at break point （MD） |
％ | ASTM D882 | 100 | 100 | 60 | 50 | ||
| Softening temperature | ℃ | Mitsui Chemicals Tohcello method*2 | 47 | 47 | 52 | 52 | ||
| Dimensional change rate after heating （MD） |
％ | Mitsui Chemicals Tohcello method*3 | 2.1 | 1.4 | 1.6 | -0.6 | ||
| Dimensional change rate after heating （TD） |
％ | Mitsui Chemicals Tohcello method*3 | -1.8 | -0.9 | -1.1 | 0.3 | ||
| Water absorption rate | ％ | ASTM D570 | ＜0.01 | ＜0.01 | ＜0.01 | ＜0.01 | ||
| Dielectric constant （12 GHz） |
－ | ASTM D150 | 2.1 | 2.1 | 2.1 | 2.1 | ||
| Dielectric tangent （12GHz） |
－ | ASTM D150 | ＜0.001 | ＜0.001 | ＜0.001 | ＜0.001 | ||
| Structure | ●Single-layer |
|||||||
| Grade | Multi-layer film | |||||
| CR1012 | CR1012MT4 | CR1033 | CR2031MT4 | |||
| Thickness | 150μm | 150μm | 150μｍ | 120μm | ||
| Item | Unit | Test method /Surface treatment |
Untreated surface (gloss) |
Both sides embossed (both sides matte) |
Untreated surface (gloss) |
Both sides embossed (both sides matte) |
| Tensile modulus （MD） |
MPa | ASTM D882 | 1200 | 1200 | 850 | 1400 |
| Yield point strength （MD） |
MPa | ASTM D882 | 20 | 19 | 13 | 22 |
| Tensile strength （MD） |
MPa | ASTM D882 | 22 | 23 | 19 | 26 |
| Elongation at break point （MD） |
％ | ASTM D882 | 160 | 160 | 170 | 120 |
| Softening temperature |
℃ | Mitsui Chemicals Tohcello method(*2) |
42 | 42 | 29 | 46 |
| Dimensional change rate after heating （MD） |
％ | Mitsui Chemicals Tohcello method(*3） |
0.7 | 0 | 0.5 | -1.6 |
| Dimensional change rate after heating （TD） |
％ | Mitsui Chemicals Tohcello method(*3） |
-1.0 | -0.4 | -0.8 | 0.5 |
| Water absorption rate |
％ | ASTM D570 | ＜0.01 | ＜0.01 | ＜0.01 | ＜0.01 |
| Dielectric constant （12 GHz） |
－ | ASTM D150 | 2.1 | 2.1 | 2.3 | 2.1 |
| Dielectric tangent （12 GHz） |
－ | ASTM D150 | ＜0.001 | ＜0.001 | ＜0.01 | ＜0.001 |
| Structure | ●Multi-layer |
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*2：Softening temperature is the temperate at which the tensile modulus reaches 300 MPa.
*3：Involves heating a film specimen in an oven, cooling it to room temperature, and then measuring its dimensions.
Specimen: 300 mm×300 mm; Heating conditions: 170℃ for 30 min; Dimensional change ratio after heating = (dimensions after heating – original dimensions) / original dimensions X 100
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